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List of Figures 5
Thermal Design Guide for Socket F (1207) Processors
32800 Rev. 3.00 August 2006
List of Figures
Figure 1. The 1207-Pin Socket. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .14
Figure 2. Motherboard Component Height Restrictions for Platforms Using the
AMD PIB Thermal Solution. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15
Figure 3. Exploded View of Thermal Solution AMD PIB Platforms based on
Socket F (1207) Processors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .18
Figure 4. Motherboard Component Height Restrictions for Custom 1U-2P Systems . . . . . . . . . .21
Figure 5. Exploded View of Thermal Solution for Custom 1U-2P Systems . . . . . . . . . . . . . . . . .24
Figure 6. High Performance Heat Sink for Custom 1U-2P Systems . . . . . . . . . . . . . . . . . . . . . . .25
Figure 7. Thermal Performance Chart of Heat Sink When Used with a Dual-Core Processor
in 90 nm Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .26
Figure 8. Motherboard Component-Height Restrictions for Custom 2U-4P Systems. . . . . . . . . .29
Figure 9. Exploded View of Thermal Solution for Custom 2U-4P System Based on Socket F
(1207) Processors32
Figure 10. High Performance Heat Sink for Custom 2U-4P Systems . . . . . . . . . . . . . . . . . . . . . . .34
Figure 11. Thermal Performance Chart of Heat Sink When Used with a Dual-Core Processor
in 90 nm Process . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .35
Figure 12. Socket F (1207) PIB Board Component Height Restrictions . . . . . . . . . . . . . . . . . . . . .38
Figure 13. Socket F (1207) PIB Mounting Holes, Contact Pads, and No-Routing Zone . . . . . . . .39
Figure 14. Socket F (1207) PIB Socket Outline and Socket Window . . . . . . . . . . . . . . . . . . . . . . .40
Figure 15. Socket F (1207) PIB Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . . . .41
Figure 16. Socket F (1207) PIB Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . . . .42
Figure 17. Socket F (1207) PIB Board Bottom Side Keep-Out. . . . . . . . . . . . . . . . . . . . . . . . . . . .43
Figure 18. Socket F (1207) 1U-2P Board Component Height Restrictions. . . . . . . . . . . . . . . . . . .46
Figure 19. Socket F (1207) 1U-2P Mounting Holes, Contact Pads, and No-Routing Zone . . . . . .47
Figure 20. Socket F (1207) 1U-2P Socket Outline and Socket Window. . . . . . . . . . . . . . . . . . . . .48
Figure 21. Socket F (1207) 1U-2P Heat Sink Height Restriction Zone. . . . . . . . . . . . . . . . . . . . . .49
Figure 22. Socket F (1207) 1U-2P Board No-Through-Hole Keep-Out . . . . . . . . . . . . . . . . . . . . .50
Figure 23. Socket F (1207) 1U-2P Backplate Contact Zone . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .51
Figure 24. Socket F (1207) 2U-4P Board Component Height Restrictions. . . . . . . . . . . . . . . . . . .54
Figure 25. Socket F (1207) 2U-4P Mounting Holes, Contact Pads, and No-Routing Zone . . . . . .55