Filter
Top Products
Packaging Technology
R
10 Intel
®
955X Express Chipset Thermal/Mechanical Design Guide
Figure 2-3. MCH Package Dimensions (Bottom View)
NOTES:
1. All dimensions are in millimeters.
2. All dimensions and tolerances conform to ANSI Y14.5M-1994.
2.1 Package Mechanical Requirements
The MCH package has an exposed bare die that is capable of sustaining a maximum static normal
load of 10-lbf. The package is NOT capable of sustaining a dynamic or static compressive load
applied to any edge of the bare die. These mechanical load limits must not be exceeded during
heatsink installation, mechanical stress testing, standard shipping conditions and/or any other use
condition.
Note:
1. The heatsink attach solutions must not result in continuous stress onto the chipset package
with the exception of a uniform load to maintain the heatsink-to-package thermal interface.
2. These specifications apply to uniform compressive loading in a direction perpendicular to the
bare die top surface.
3. These specifications are based on limited testing for design characterization. Loading limits
are for the package only.
§