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955X Express Chipset Thermal/Mechanical Design Guide 3
Contents
1
Introduction .........................................................................................................................7
1.1 Definition of Terms .................................................................................................8
1.2 Reference Documents............................................................................................8
2 Packaging Technology........................................................................................................9
2.1 Package Mechanical Requirements.....................................................................10
3 Thermal Specifications......................................................................................................11
3.1 Thermal Design Power (TDP)..............................................................................11
3.2 Die Case Temperature Specifications..................................................................11
4 Thermal Simulation ...........................................................................................................13
5 Thermal Metrology ............................................................................................................15
5.1 Die Case Temperature Measurements................................................................15
5.1.1 Zero Degree Angle Attach Methodology ..............................................15
6 Reference Thermal Solution .............................................................................................17
6.1 Operating Environment ........................................................................................17
6.2 Heatsink Performance..........................................................................................17
6.3 Mechanical Design Envelope...............................................................................18
6.4 Board-Level Components Keep-out Dimensions.................................................20
6.5 Reference Heatsink Thermal Solution Assembly.................................................21
6.5.1 Heatsink Orientation .............................................................................22
6.5.2 Extruded Heatsink Profiles ...................................................................22
6.5.3 Mechanical Interface Material...............................................................23
6.5.4 Thermal Interface Material....................................................................23
6.5.4.1 Effect of Pressure on TIM Performance..............................24
6.5.5 Heatsink Clip.........................................................................................24
6.5.6 Clip Retention Anchors.........................................................................24
6.6 Reliability Guidelines............................................................................................25
7 Appendix A: Thermal Solution Component Suppliers.......................................................27
8 Appendix B: Mechanical Drawings ...................................................................................29