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Introduction
R
8 Intel
®
955X Express Chipset Thermal/Mechanical Design Guide
1.1 Definition of Terms
Term Description
BGA Ball grid array. A package type, defined by a resin-fiber substrate, onto which a die is
mounted, bonded and encapsulated in molding compound. The primary electrical interface is
an array of solder balls attached to the substrate opposite the die and molding compound.
BLT Bond line thickness. Final settled thickness of the thermal interface material after installation
of heatsink.
ICH7 I/O Controller Hub. Seventh generation I/O Controller Hub component that contains
additional functionality compared to previous ICH components. The I/O Controller Hub
component that contains the primary PCI interface, LPC interface, USB2, ATA-100, and
other I/O functions. It communicates with the MCH over a proprietary interconnect called
DMI.
MCH Memory Controller Hub. The chipset component that contains the processor interface, the
memory interface, and the DMI.
T
case_max
Maximum die temperature allowed. This temperature is measured at the geometric center of
the top of the package die.
T
case_min
Minimum die temperature allowed. This temperature is measured at the geometric center of
the top of the package die.
TDP Thermal design power. Thermal solutions should be designed to dissipate this target power
level. TDP is not the maximum power that the chipset can dissipate.
1.2 Reference Documents
The reader of this specification should also be familiar with material and concepts presented in
the following documents:
Document Title Document Number / Location
Intel
®
I/O Controller Hub 7 (ICH7) Thermal Design Guidelines http://developer.intel.com//desi
gn/chipsets/designex/307015.htm
Intel
®
I/O Controller Hub 7 (ICH7) Datasheet http://developer.intel.com//design/c
hipsets/datashts/307013.htm
Intel
®
955X Express Chipset Datasheet http://developer.intel.com/design/c
hipsets/datashts/306828.htm
BGA/OLGA Assembly Development Guide Contact your Intel Field Sales
Representative
Various system thermal design suggestions http://www.formfactors.org
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