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Intel
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955X Express Chipset Thermal/Mechanical Design Guide 11
3 Thermal Specifications
3.1 Thermal Design Power (TDP)
Analysis indicates that real applications are unlikely to cause the chipset MCH to consume
maximum power dissipation for sustained time periods. Therefore, to arrive at a more realistic
power level for thermal design purposes, Intel characterizes power consumption based on known
platform benchmark applications. The resulting power consumption is referred to as the Thermal
Design Power (TDP). TDP is the target power level that the thermal solutions should be designed
to. TDP is not the maximum power that the chipset can dissipate.
For TDP specifications, see Table 3-1 for the 955X Express chipset MCH. FC-BGA packages
have limited heat transfer capability into the board and have minimal thermal capability without a
thermal solution. Intel recommends that system designers plan for one or more heatsinks when
using the 955X Express chipset.
3.2 Die Case Temperature Specifications
To ensure proper operation and reliability of the MCH, the die temperatures must be at or
between the maximum/minimum operating range as specified in Table 3-1 for the 82955X MCH.
System and/or component level thermal solutions are required to maintain these temperature
specifications. Refer to Chapter 5 for guidelines on accurately measuring package die
temperatures.
Table 3-1. MCH Thermal Specifications
Parameter Value Notes
T
case_max
105 °C —
T
case_min
5 °C —
TDP
dual channel
13.5 W DDR2-667
NOTE: These specifications are based on silicon characterization; however, they may be updated as further
data becomes available.
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