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Reference Thermal Solution
R
18 Intel
®
955X Express Chipset Thermal/Mechanical Design Guide
Figure 6-1. Reference Heatsink Measured Thermal Performance versus Approach Velocity
6.3 Mechanical Design Envelope
While each design may have unique mechanical volume and height restrictions or implementation
requirements, the height, width, and depth constraints typically placed on the MCH thermal
solution are shown in Figure 6-2.
When using heatsinks that extend beyond the MCH reference heatsink envelope shown in
Figure 6-2, any motherboard components placed between the heatsink and motherboard cannot
exceed 2.2 mm (0.087 in.) in height.