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Reference Thermal Solution
R
Intel
®
955X Express Chipset Thermal/Mechanical Design Guide 23
Figure 6-6. Plastic Wave Soldering Heatsink Extrusion Profile
NOTE: All dimensions are in millimeters, with dimensions in braces expressed in inches.
6.5.3 Mechanical Interface Material
There is no mechanical interface material associated with this reference solution.
6.5.4 Thermal Interface Material
A TIM provides improved conductivity between the die and heatsink. The reference thermal
solution uses Honeywell PCM 45F, 0.25 mm (0.010 in.) thick, 15 mm x 15 mm
(0.59 in. x 0.59 in.) square.
Note: Unflowed or “dry” Honeywell PCM 45F has a material thickness of 0.010 inch. The flowed or
“wet” Honeywell PCM 45F has a material thickness of ~0.003 inches after it reaches its phase
change temperature.