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Reference Thermal Solution
R
Intel
®
955X Express Chipset Thermal/Mechanical Design Guide 21
Figure 6-4. Retention Mechanism Component Keep-out Zones
4 x 8.76mm
4 x 5.08mm
4 x 1.84mm
8 x Ø0.97 mm P lated Thru H ole
8 x Ø1.42 mm Trace Keepout
No Components
this Area
4 x 8.76 m m
Max 1.27mm
Component
Height
RM_Component_KeepoutZones
6.5 Reference Heatsink Thermal Solution Assembly
The reference thermal solution for the MCH is a passive extruded heatsink with thermal interface.
It is attached using a clip with each end hooked through an anchor soldered to the board. Figure
6-5 shows the reference thermal solution assembly and associated components.
Full mechanical drawings of the thermal solution assembly and the heatsink clip are provided in
Appendix B. Appendix A contains vendor information for each thermal solution component.