Filter
Top Products
Figure 3. Attachment to Motherboard
Socket Components
The socket has two main components, the socket body and Pick and Place (PnP)
cover, and is delivered as a single integral assembly. Refer to Socket Mechanical
Drawings for detailed drawings.
Socket Body Housing
The housing material is thermoplastic or equivalent with UL 94 V-0 flame rating
capable of withstanding 260 °C for 40 seconds, which is compatible with typical
reflow/rework profiles. The socket coefficient of thermal expansion (in the XY plane)
and creep properties must be such that the integrity of the socket is maintained for
the conditions listed in LGA1150 Socket and ILM Specifications on page 24.
The color of the housing will be dark as compared to the solder balls to provide the
contrast needed for pick and place vision systems.
Solder Balls
A total of 1150 solder balls corresponding to the contacts are on the bottom of the
socket for surface mounting with the motherboard. The socket solder ball has the
following characteristics:
2.3
LGA1150 Socket—LGA1150 Socket
LGA1150 Socket
September 2013 Application Guide
Order No.: 328999-002 11