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3.0 Independent Loading Mechanism (ILM)
The ILM has two critical functions – deliver the force to seat the processor onto the
socket contacts and distribute the resulting compressive load evenly through the
socket solder joints.
The mechanical design of the ILM is integral to the overall functionality of the
LGA1150 socket. Intel performs detailed studies on integration of processor package,
socket and ILM as a system. These studies directly impact the design of the ILM. The
Intel reference ILM will be “build to print” from Intel controlled drawings. Intel
recommends using the Intel Reference ILM. Custom non-Intel ILM designs do not
benefit from Intel's detailed studies and may not incorporate critical design
parameters.
Note: There is a single ILM design for the LGA1150 socket, LGA1156 socket, and LGA1155
socket.
Design Concept
The ILM consists of two assemblies that will be procured as a set from the enabled
vendors. These two components are ILM assembly and back plate. To secure the two
assemblies, two types of fasteners are required – a pair (2) of standard 6-32 thread
screws and a custom 6-32 thread shoulder screw. The reference design incorporates a
T-20 Torx* head fastener. The Torx* head fastener was chosen to ensure end users
do not inadvertently remove the ILM assembly and for consistency with the LGA1366
socket ILM. The Torx* head fastener is also less susceptible to driver slippage. Once
assembled the ILM is not required to be removed to install / remove the motherboard
from a chassis.
ILM Assembly Design Overview
The ILM assembly consists of 4 major pieces – ILM cover, load lever, load plate, and
the hinge frame assembly.
All of the pieces in the ILM assembly except the hinge frame and the screws used to
attach the back plate are fabricated from stainless steel. The hinge frame is plated.
The frame provides the hinge locations for the load lever and load plate. An insulator
is pre-applied to the bottom surface of the hinge frame.
Figure 14 on page 30 through Figure 17 on page 33 list the applicable keep-out
zones of the socket and ILM. Figure 14 on page 30 describes recommended
maximum heights of neighboring components on the primary side of the board to
avoid interference with the Intel
®
reference thermal solution. The keep-out zone in
Figure 14 on page 30 does not prevent incidental contact with the ILM load plate
and ILM cover while it is open for insertion/removal of the processor. In designs
requiring no cosmetic marks to be made on capacitors along the hinge side of the ILM,
the recommendation is for the location of the capacitors to be against the keep-out
zone boundary closest to the hinge of the ILM. This location does not prevent contact
between the ILM and the capacitors; however it minimizes the load applied by the ILM
to the capacitors.
3.1
LGA1150 Socket—Independent Loading Mechanism (ILM)
LGA1150 Socket
Application Guide September 2013
16 Order No.: 328999-002