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2.0 LGA1150 Socket
This chapter describes a surface mount, LGA (Land Grid Array) socket intended for the
processors. The socket provides I/O, power and ground contacts. The socket contains
1150 contacts arrayed about a cavity in the center of the socket with lead-free solder
balls for surface mounting on the motherboard.
The contacts are arranged in two opposing L-shaped patterns within the grid array.
The grid array is 40 x 40 with 24 x 16 grid depopulation in the center of the array and
selective depopulation elsewhere.
The socket must be compatible with the package (processor) and the Independent
Loading Mechanism (ILM). The ILM design includes a back plate which is integral to
having a uniform load on the socket solder joints. Socket loading specifications are
listed in LGA1150 Socket and ILM Specifications on page 24.
Figure 1. LGA1150 Pick and Place Cover
Board Layout
The land pattern for the LGA1150 socket is 36 mils X 36 mils (X by Y) within each of
the two L-shaped sections. There is no round-off (conversion) error between socket
pitch (0.9144 mm) and board pitch (36 mil) as these values are equivalent. The two
L-sections are offset by 0.9144 mm (36 mil) in the x direction and 3.114 mm
(122.6 mil) in the y direction see Figure 2 on page 10. This was to achieve a
common package land to PCB land offset that ensures a single PCB layout for socket
designs from the multiple vendors.
2.1
LGA1150 Socket—LGA1150 Socket
LGA1150 Socket
September 2013 Application Guide
Order No.: 328999-002 9