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The ILM assembly design ensures that, once assembled to the back plate, the only
features touching the board are the shoulder screw and the insulated hinge frame
assembly. The nominal gap of the load plate to the board is ~1 mm.
When closed, the load plate applies two point loads onto the IHS at the “dimpled”
features shown in Figure 6 on page 17. The reaction force from closing the load
plate is transmitted to the hinge frame assembly and through the fasteners to the
back plate. Some of the load is passed through the socket body to the board, inducing
a slight compression on the solder joints.
A pin 1 indicator will be marked on the ILM assembly.
Figure 6. ILM Assembly with Installed Processor
Independent Loading Mechanism (ILM) Back Plate Design Overview
The back plate is a flat steel back plate with pierced and extruded features for ILM
attach. A clearance hole is located at the center of the plate to allow access to test
points and backside capacitors if required. An insulator is pre-applied. A notch is
placed in one corner to assist in orienting the back plate during assembly.
Note: The Server ILM back plate is different from the Desktop design. Since Server
secondary-side clearance of 3.0 mm [0.118 inch] is generally available for leads and
backside components, so Server ILM back plate is designed with 1.8 mm thickness
and 2.2 mm entire height including punch protrusion length.
Caution: Intel does NOT recommend using the server back plate for high-volume desktop
applications at this time as the server back plate test conditions cover a limited
envelope. Back plates and screws are similar in appearance. To prevent mixing,
different levels of differentiation between server and desktop back plate and screws
have been implemented.
For ILM back plate, three levels of differentiation have been implemented:
• Unique part numbers, please refer to part numbers listed in Table 7 on page 28.
• Desktop ILM back plate to use black lettering for marking versus server ILM back
plate to use yellow lettering for marking.
Independent Loading Mechanism (ILM)—LGA1150 Socket
LGA1150 Socket
September 2013 Application Guide
Order No.: 328999-002 17