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• Lead free SAC (SnAgCu) 305 solder alloy with a silver (Ag) content between 3%
and 4% and a melting temperature of approximately 217 °C. The alloy is
compatible with immersion silver (ImAg) and Organic Solderability Protectant
(OSP) motherboard surface finishes and a SAC alloy solder paste.
• Solder ball diameter 0.6 mm ± 0.02 mm, before attaching to the socket lead.
The co-planarity (profile) and true position requirements are defined in Socket
Mechanical Drawings.
Contacts
Base material for the contacts is high strength copper alloy.
For the area on socket contacts where processor lands will mate, there is a 0.381 µm
[15 µinches] minimum gold plating over 1.27 µm [50 minches] minimum nickel
underplate.
No contamination by solder in the contact area is allowed during solder reflow.
Pick and Place Cover
The cover provides a planar surface for vacuum pick up used to place components in
the Surface Mount Technology (SMT) manufacturing line. The cover remains on the
socket during reflow to help prevent contamination during reflow. The cover can
withstand 260 °C for 40 seconds (typical reflow/rework profile) and the conditions
listed in LGA1150 Socket and ILM Specifications on page 24 without degrading.
As indicated in Figure 4 on page 13, the cover remains on the socket during ILM
installation, and should remain on whenever possible to help prevent damage to the
socket contacts.
Cover retention must be sufficient to support the socket weight during lifting,
translation, and placement (board manufacturing), and during board and system
shipping and handling. PnP Cover should only be removed with tools, to prevent the
cover from falling into the contacts.
The socket vendors have a common interface on the socket body where the PnP cover
attaches to the socket body. This should allow the PnP covers to be compatible
between socket suppliers.
As indicated in Figure 4 on page 13, a Pin 1 indicator on the cover provides a visual
reference for proper orientation with the socket.
LGA1150 Socket—LGA1150 Socket
LGA1150 Socket
Application Guide September 2013
12 Order No.: 328999-002