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Figure 5. Package Installation / Removal Features
Socket Standoffs and Package Seating Plane
Standoffs on the bottom of the socket base establish the minimum socket height after
solder reflow and are specified in Socket Mechanical Drawings.
Similarly, a seating plane on the topside of the socket establishes the minimum
package height. See Package / Socket Stackup Height on page 24 for the calculated
IHS height above the motherboard.
Durability
The socket must withstand 20 cycles of processor insertion and removal. The
maximum chain contact resistance from Table 6 on page 26 must be met when
mated in the 1st and 20th cycles.
The socket Pick and Place cover must withstand 15 cycles of insertion and removal.
Markings
There are three markings on the socket:
• LGA1150: Font type is Helvetica Bold - minimum 6 point (2.125 mm). This mark
will also appear on the pick and place cap.
• Manufacturer's insignia (font size at supplier discretion).
• Lot identification code (allows traceability of manufacturing date and location).
All markings must withstand 260 °C for 40 seconds (typical reflow/rework profile)
without degrading, and must be visible after the socket is mounted on the
motherboard.
LGA1150 and the manufacturer's insignia are molded or laser marked on the side wall.
2.5
2.6
LGA1150 Socket—LGA1150 Socket
LGA1150 Socket
Application Guide September 2013
14 Order No.: 328999-002