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Term Description
FSC Fan Speed Control
IHS Integrated Heat Spreader: a component of the processor package used to enhance the
thermal performance of the package. Component thermal solutions interface with the
processor at the IHS surface.
ILM Independent Loading Mechanism provides the force needed to seat the LGA1150 land
package onto the socket contacts.
MD Metal Defined pad is one where a pad is individually etched into the PCB with a minimum
width trace exiting it.
PCH Platform Controller Hub. The PCH is connected to the processor using the Direct Media
Interface (DMI) and Intel
®
Flexible Display Interface (Intel
®
FDI).
LGA1150 socket The processor mates with the system board through this surface mount, 1150-land
socket.
PECI The Platform Environment Control Interface (PECI) is a one-wire interface that provides a
communication channel between Intel processor and chipset components to external
monitoring devices.
Ψ
ca
Case-to-ambient thermal characterization parameter (psi). A measure of thermal solution
performance using total package power. Defined as (T
CASE
– T
LA
) / Total Package Power.
The heat source should always be specified for Y measurements.
Ψ
CS
Case-to-sink thermal characterization parameter. A measure of thermal interface material
performance using total package power. Defined as (T
CASE
– T
S
) / Total Package Power.
Ψ
sa
Sink-to-ambient thermal characterization parameter. A measure of heatsink thermal
performance using total package power. Defined as (T
S
– T
LA
) / Total Package Power.
SMD The Solder Mask Defined pad is typically a pad in a flood plane where the solder mask
opening defines the pad size for soldering to the component to the printed circuit board.
T
CASE
or T
C
The case temperature of the processor, measured at the geometric center of the topside
of the TTV IHS.
T
CASE
_
MAX
The maximum case temperature as specified in a component specification.
TCC Thermal Control Circuit: Thermal monitor uses the TCC to reduce the die temperature by
using clock modulation and/or operating frequency and input voltage adjustment when
the die temperature is very near its operating limits.
T
CONTROL
T
CONTROL
is a static value that is below the TCC activation temperature and used as a
trigger point for fan speed control. When DTS > T
CONTROL
, the processor must comply to
the TTV thermal profile.
TDP Thermal Design Power: Thermal solution should be designed to dissipate this target
power level. TDP is not the maximum power that the processor can dissipate.
Thermal Monitor A power reduction feature designed to decrease temperature after the processor has
reached its maximum operating temperature.
Thermal Profile Line that defines case temperature specification of the TTV at a given power level.
TIM Thermal Interface Material: The thermally conductive compound between the heatsink
and the processor case. This material fills the air gaps and voids, and enhances the
transfer of the heat from the processor case to the heatsink.
TTV Thermal Test Vehicle. A mechanically equivalent package that contains a resistive heater
in the die to evaluate thermal solutions.
T
LA
The measured ambient temperature locally surrounding the processor. The ambient
temperature should be measured just upstream of a passive heatsink or at the fan inlet
for an active heatsink.
T
SA
The system ambient air temperature external to a system chassis. This temperature is
usually measured at the chassis air inlets.
LGA1150 Socket—Introduction
LGA1150 Socket
Application Guide September 2013
8 Order No.: 328999-002