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Figure 4. Pick and Place Cover
Package Installation / Removal
As indicated in Figure 5 on page 14, access is provided to facilitate manual
installation and removal of the package.
To assist in package orientation and alignment with the socket:
• The package Pin 1 triangle and the socket Pin 1 chamfer provide visual reference
for proper orientation.
• The package substrate has orientation notches along two opposing edges of the
package, offset from the centerline. The socket has two corresponding orientation
posts to physically prevent mis-orientation of the package. These orientation
features also provide initial rough alignment of package to socket.
• The socket has alignment walls at the four corners to provide final alignment of
the package.
2.4
LGA1150 Socket—LGA1150 Socket
LGA1150 Socket
September 2013 Application Guide
Order No.: 328999-002 13