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Thermal Specifications
16 Intel
®
E8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
NOTE:
1. These specifications are based on silicon characterization, however, they may be updated as further data
becomes available.
§
Table 3-2. Intel
®
E8500 Chipset XMB Thermal Specifications
Parameter Value Notes
T
case_max
105°C
T
case_min
5°C
TDP
dual channel
9.1W DDR-266
TDP
dual channel
9.3W DDR-333
TDP
dual channel
8.5W DDR2-400