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E8500 Chipset North Bridge (NB) and eXternal Memory 3
Bridge (XMB) Thermal/Mechanical Design Guide
Contents
1 Introduction.........................................................................................................................7
1.1 Design Flow .........................................................................................................................7
1.2 Definition of Terms...............................................................................................................8
1.3 Reference Documents .........................................................................................................9
2 Packaging Technology.....................................................................................................11
2.1 Package Mechanical Requirements ..................................................................................14
3 Thermal Specifications.....................................................................................................15
3.1 Thermal Design Power (TDP)............................................................................................15
3.2 Die Case Temperature Specifications ...............................................................................15
4 Thermal Simulation ..........................................................................................................17
5 Thermal Metrology ...........................................................................................................19
5.1 Die Case Temperature Measurements..............................................................................19
5.2 Power Simulation Software................................................................................................21
6 NB Reference Thermal Solution #1..................................................................................23
6.1 Operating Environment......................................................................................................23
6.2 Heatsink Performance .......................................................................................................23
6.3 Mechanical Design Envelope.............................................................................................24
6.4 Board-Level Components Keepout Dimensions ................................................................25
6.5 First NB Heatsink Thermal Solution Assembly ..................................................................26
6.5.1 Heatsink Orientation............................................................................................27
6.5.2 Extruded Heatsink Profiles ..................................................................................27
6.5.3 Mechanical Interface Material..............................................................................27
6.5.4 Thermal Interface Material...................................................................................27
6.5.5 Heatsink Retaining Fastener ...............................................................................28
6.6 Reliability Guidelines..........................................................................................................29
7 NB Reference Thermal Solution #2..................................................................................31
7.1 Operating Environment......................................................................................................31
7.2 Heatsink Performance .......................................................................................................31
7.3 Mechanical Design Envelope.............................................................................................32
7.4 Board-Level Components Keepout Dimensions ................................................................33
7.5 Second NB Heatsink Thermal Solution Assembly .............................................................33
7.5.1 Heatsink Orientation............................................................................................34
7.5.2 Extruded Heatsink Profiles ..................................................................................34
7.5.3 Mechanical Interface Material..............................................................................34
7.5.4 Thermal Interface Material...................................................................................34
7.5.5 Heatsink Retaining Fastener ...............................................................................34
7.6 Reliability Guidelines..........................................................................................................35
8 XMB Reference Thermal Solution....................................................................................37
8.1 Operating Environment......................................................................................................37
8.2 Heatsink Performance .......................................................................................................37
8.3 Mechanical Design Envelope.............................................................................................38
8.4 Board-Level Components Keepout Dimensions ................................................................38