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Intel
®
E8500 Chipset North Bridge (NB) and eXternal Memory 33
Bridge (XMB) Thermal/Mechanical Design Guide
NB Reference Thermal Solution #2
7.4 Board-Level Components Keepout Dimensions
Please refer to Section 6.4 for detail.
7.5 Second NB Heatsink Thermal Solution Assembly
The reference thermal solution for the chipset NB component is a passive extruded heatsink with
thermal interlace. It is attached to the board by using four retaining Tuflok fasteners. Figure 7-3
shows the reference thermal solution assembly and associated components.
Full mechanical drawings of the thermal solution assembly and the heatsink are provided in
Appendix B. Appendix A contains vendor information for each thermal solution component.
Figure 7-2. Second NB Reference Heatsink Volumetric Envelope
Heatsink
Fin
42.50 mm.
Heatsink Base
64.52 mm.
64.52 mm.
Heatsink Base
IHS + TIM2
55.09 mm.
Motherboard
Heatsink
Fin
4 mm.
4.29 mm.
FCBGA
40.50 mm.