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XMB Reference Thermal Solution
40 Intel
®
E8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
8.5.2 Extruded Heatsink Profiles
The reference XMB thermal solution uses an extruded heatsink for cooling the chipset XMB.
Figure 8-5 shows the heatsink profile. Appendix A lists a supplier for this extruded heatsink. Other
heatsinks with similar dimensions and increased thermal performance may be available. A full
mechanical drawing of this heatsink is provided in Appendix B.
8.5.3 Mechanical Interface Material
There is no mechanical interface material associated with this reference solution.
8.5.4 Thermal Interface Material
A TIM provides improved conductivity between the die and the heatsink. The reference thermal
solution uses Chomerics THERMFLOW T710, 0.127 mm (0.005 in.) thick, 17.8 mm x 17.8 mm
(0.7 in. x 0.7 in.) square.
Note: Unflowed or “dry” Chomerics THERMFLOW T710 has a material thickness of 0.005 inch.
The flowed or “wet” Chomerics THERMFLOW T710 has a material thickness of ~0.0025 inch
after it reaches its phase change temperature.
8.5.4.1 Effect of Pressure on TIM Performance
Please refer to Section 6.5.4.1 for detail.
8.5.5 Heatsink Retaining Fastener
The reference solution uses four heatsink retaining Tufloks. The fasteners attached the heatsink to
the motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting
hole. These fasteners are intended to be used on a 0.062” thickness motherboard. See Appendix B
for a mechanical drawing of the fastener.