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NB Reference Thermal Solution #1
26 Intel
®
E8500 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
6.5 First NB Heatsink Thermal Solution Assembly
The reference thermal solution for the chipset NB component is a passive extruded heatsink with
thermal interface. It is attached to the board by using four retaining Tuflok* fasteners. Figure 6-4
shows the reference thermal solution assembly and associated components.
Full mechanical drawings of the thermal solution assembly and the heatsink are provided in
Appendix B. Appendix A contains vendor information for each thermal solution component.
NOTE: All dimensions are in millimeters.
Figure 6-3. First NB Heatsink Board Component Keepout
TNB Location
4X Ø 2.95 ± 0.0254mm
64.500mm.
55.245mm.
64.500mm.55.245mm.
No Component Keep Out Area
4.14mm Max Component Height
4X Ø 5.5mm
42.500mm.
42.500mm.
Heatsink Mounting Hole
NB Location