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Technical Product Specification 5
Order #273817
Intel NetStructure
®
MPCBL0001 High Performance Single Board Computer
Contents
3.16.1 Using Serial Port Buffering ...................................................................................73
3.16.1.1 Configuring the Serial Port.....................................................................73
3.16.1.2 Configuration of Buffering/Filtering ........................................................76
3.16.1.3 Reading Buffered Data ..........................................................................76
3.16.1.4 Examples ...............................................................................................77
4 Connectors ....................................................................................................................................80
4.1 Backplane Connectors........................................................................................................84
4.1.1 Power Distribution Connector (Zone 1)..................................................................84
4.1.2 Data Transport Connector (Zone 2).......................................................................85
4.1.3 Alignment Blocks ...................................................................................................86
4.2 Front Panel Connectors......................................................................................................87
4.2.1 USB Connector (J12).............................................................................................87
4.2.2 Serial Port Connector (J17) ...................................................................................87
4.2.3 Fibre Channel Small Form-Factor Pluggable (SFP) Receptacle (J34 and J35) ....90
4.2.4 Fibre Channel SFP Optical Transceiver Module....................................................90
4.2.5 PMC Connectors (J25, J26, J27)...........................................................................91
4.3 On-board Connectors .........................................................................................................94
4.3.1 IDE Connector (J24) ..............................................................................................94
5 Addressing.....................................................................................................................................95
5.1 Configuration Registers ......................................................................................................95
5.1.1 Configuration Address Register MCH CONFIG_ADDRESS .................................95
5.1.2 Configuration Data Register MCH CONFIG_ADDRESS.......................................95
5.2 I/O Address Assignments ...................................................................................................96
5.3 Memory Map.......................................................................................................................97
5.4 IPMC Addresses.................................................................................................................98
6 Specifications ................................................................................................................................99
6.1 Mechanical Specifications ..................................................................................................99
6.1.1 Board Outline.........................................................................................................99
6.1.2 Backing Plate.......................................................................................................102
6.1.3 Component Height...............................................................................................102
6.2 Environmental Specifications............................................................................................107
6.3 Reliability Specifications ...................................................................................................107
6.3.1 Mean Time Between Failure (MTBF) Specifications............................................107
6.3.1.1 Environmental Assumptions ................................................................108
6.3.1.2 General Assumptions...........................................................................108
6.3.1.3 General Notes......................................................................................108
6.3.2 Power Consumption ............................................................................................108
6.3.3 Cooling Requirements .........................................................................................109
6.4 Board Layer Specifications ...............................................................................................109
6.5 Weight...............................................................................................................................109
7 BIOS Features.............................................................................................................................110
7.1 Introduction .......................................................................................................................110
7.2 BIOS Flash Memory Organization ....................................................................................110
7.3 Complementary Metal-Oxide Semiconductor (CMOS).....................................................110
7.3.1 Copying and Saving CMOS Settings...................................................................110
7.4 Redundant BIOS Functionality .........................................................................................111
7.5 System Management BIOS (SMBIOS).............................................................................111