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Philips Semiconductors
ISP1122
USB stand-alone hub
Product specification Rev. 03 — 29 March 2000 39 of 48
9397 750 07002
© Philips Electronics N.V. 2000. All rights reserved.
17. Package outline
Fig 23. SO32 package outline.
UNIT
A
max.
A
1
A
2
A
3
b
p
cD
(1)
E
(1)
eH
E
LL
p
QZywv θ
REFERENCES
OUTLINE
VERSION
EUROPEAN
PROJECTION
ISSUE DATE
IEC JEDEC EIAJ
mm
inches
2.65
0.10
0.25
0.01
1.4
0.055
0.3
0.1
2.45
2.25
0.49
0.36
0.27
0.18
20.7
20.3
7.6
7.4
1.27
10.65
10.00
1.2
1.0
0.95
0.55
8
0
o
o
0.25 0.1
0.004
0.25
DIMENSIONS (inch dimensions are derived from the original mm dimensions)
Note
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
1.1
0.4
SOT287-1 MO-119
(1)
0.012
0.004
0.096
0.086
0.02
0.01
0.050
0.047
0.039
0.419
0.394
0.30
0.29
0.81
0.80
0.011
0.007
0.037
0.022
0.010.01
0.043
0.016
w M
b
p
D
H
E
Z
e
c
v M
A
X
A
y
32
17
16
1
θ
A
A
1
A
2
L
p
Q
detail X
L
(A )
3
E
pin 1 index
0 5 10 mm
scale
SO32: plastic small outline package; 32 leads; body width 7.5 mm
SOT287-1
97-05-22
99-12-27