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Toshiba Corporation Digital Media Network Company
Page 19 of 153
© 2003, Copyright TOSHIBA Corporation All Rights Reserved
8.3.1 Installation
1) The drive should be interconnected of mounted carefully on the surface of 0.1mm or less flatness to avoid
excessive distortion.
2) The drive can be easily damaged by shocks. In order to prevent the damege, avoid giving shock to the
drive.
3) Don’t apply any force to the top cover.
4) The drive contains several parts which may be easily damaged by ESD(Electric Static Discharge). Avoid
touching the interface connector pins and surface of PCB.
5) The temperature of top cover and the base must always be kept under 65°C to maintain the required
reliability. (If the drive runs continuousely or spins-up frequently, the temperature of the top cover may rise
to 15°C maximum. If the drive is used in ambient temperature of 50 °C or more, it should be kept where
adequate ventilation is available to keep the temperature of top cover under 65°C)
6) Be careful when removing the drive from the host device. The drive may have heated up during operation.
7) Do not disassemble, modify or repair.
8) A rattle heard when the drive is moved is not a sign of failure.
9) Provision for tying the DC logic ground and the chassis ground together or for separating these ground is
user specific.
Agreeable locations of chassis ground are in Figure 1 and Figure 2.