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Intel
®
5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
July 2008 TDG
Order Number: 318676-003US 11
Intel
®
5100 MCH Chipset
2.1 Package Mechanical Requirements
The Intel
®
5100 MCH Chipset package has an integrated heat spreader (IHS) that is
capable of sustaining a maximum static normal load of 15 lbf. These mechanical load
limits must not be exceeded during heatsink installation, mechanical stress testing,
standard shipping conditions and/or any other use condition.
Note: The heatsink attach solutions must not include continuous stress to the chipset
package with the exception of a uniform load to maintain the heatsink-to-package
thermal interface.
Figure 4. MCH Package Dimensions (Bottom View)
Notes:
1. All dimensions are in millimeters.
2. All dimensions and tolerances conform to ANSI Y14.5M-1994.
42.5 + 0.05
11 252321191715139753127293733 3531
2822 26242018161412108642 36343230 38
A
AJ
AE
AC
AA
U
R
N
L
J
G
E
C
W
AG
AL
AN
AR
AU
AH
AF
AD
AB
Y
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M
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H
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AM
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B
A
B
42.5 + 0.05
C A0.2
- A -
37X 1.092
20.202
20.202
37X 1.092