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Intel
®
5100 MCH Chipset
Intel
®
5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
TDG July 2008
24 Order Number: 318676-003US
Note: Prior to installing the heatsink, be sure that the thermocouple wires remain below the
IHS top surface by running a flat blade on top of the IHS, for example.
5.2 Power Simulation Software
Power simulation software now exists for the Intel
®
5100 MCH Chipset. The power
simulation software is a utility designed to dissipate the thermal design power on a
Intel
®
5100 MCH Chipset when used in conjunction with the Dual-Core Intel
®
Xeon
®
processor 5X00 series. The combination of the above mentioned processor(s) and the
higher bandwidth capability of the Intel
®
5100 MCH Chipset enables higher levels of
system performance. To assess the thermal performance of the MCH chipset thermal
solution under “worst-case realistic application” conditions, Intel developed a software
utility that operates the chipset at near worst-case thermal power dissipation.
The power simulation software developed should only be used to test thermal solutions
at or near the thermal design power. Real world applications may exceed the thermal
design power limit for transient time periods. For power supply current requirements
under these transient conditions, please refer to each component’s datasheet for the
ICC (Max Power Supply Current) specification. Contact your Intel field sales
representative to order the power simulation software: Intel
®
5100 Memory Controller
Hub Chipset (embedded) – Maximum Power Application.
6.0 Reference Thermal Solution
Intel has developed two reference thermal solutions that meet the cooling needs of the
Intel
®
5100 MCH Chipset under the embedded operating environments and
specifications defined in this document. This chapter describes the overall requirements
for the torsional clip heatsink reference thermal solution including critical-to-function
dimensions, operating environment, and validation criteria. Other chipset components
may or may not need attached thermal solutions depending on your specific system
local-ambient operating conditions. For information on the ICH9R, refer to the thermal
specification in the Intel
®
I/O Controller Hub 9 (ICH9) Family Thermal and Mechanical
Design Guidelines.
Figure 17. Filling Groove with Adhesive