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Intel
®
5100 MCH Chipset
Intel
®
5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
TDG July 2008
4 Order Number: 318676-003US
Figures
1 Thermal Design Process ............................................................................................. 7
2 MCH Package Dimensions (Top View)..........................................................................10
3 MCH Package Dimensions (Side View) .........................................................................10
4 MCH Package Dimensions (Bottom View) .....................................................................11
5 Processor Thermal Characterization Parameter Relationships..........................................13
6 IHS Groove Dimensions.............................................................................................17
7 Orientation of Thermocouple Groove Relative to Package Pin..........................................18
8 Bending Tip of Thermocouple .....................................................................................18
9 Securing Thermocouple Wires with Kapton Tape Prior to Attach ......................................19
10 Thermocouple Bead Placement...................................................................................20
11 Positioning Bead on Groove .......................................................................................20
12 Using 3D Micromanipulator to Secure Bead Location......................................................21
13 Measuring Resistance between Thermocouple and IHS ..................................................21
14 Applying Adhesive on Thermocouple Bead....................................................................22
15 Thermocouple Wire Management in Groove..................................................................23
16 Removing Excess Adhesive from IHS...........................................................................23
17 Filling Groove with Adhesive ......................................................................................24
18 Torsional Clip Heatsink Measured Thermal Performance versus Approach Velocity .............25
19 AdvancedTCA* Torsional Clip Heatsink Volumetric Envelope for MCH Heatsink ..................26
20 Torsional Clip Heatsink Assembly................................................................................27
21 Isometric View of the CompactPCI* Reference Heatsink.................................................29
22 CompactPCI* Reference Heatsink Thermal Performance.................................................30
23 AdvancedTCA* Heatsink Assembly Drawing .................................................................32
24 AdvancedTCA* Heatsink Drawing................................................................................33
25 AdvancedTCA* Component Keepout Zone....................................................................34
26 CompactPCI* Heatsink Assembly Drawing ...................................................................35
27 CompactPCI* Heatsink Drawing..................................................................................36
28 CompactPCI* Component Keepout Zone......................................................................37
29 Torsional Clip Heatsink Clip Drawing ...........................................................................38
30 TIM2 Drawing ..........................................................................................................39
Tables
1 Definition of Terms .................................................................................................... 7
2 Related Documents.................................................................................................... 8
3Intel
®
5100 Memory Controller Hub Chipset Thermal Specifications.................................12
4 Required Heatsink Thermal Performance (Ψ
CA
).............................................................15
5 Thermocouple Attach Support Equipment ....................................................................16
6 Honeywell* PCM45F TIM Performance as Function of Attach Pressure ..............................28
7 Reliability Guidelines.................................................................................................29
8 Reliability Requirements ............................................................................................30
9 Mechanical Drawing List ............................................................................................31
10 MCH Torsional Clip Heatsink Thermal Solution ..............................................................40