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Intel
®
5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
July 2008 TDG
Order Number: 318676-003US 9
Intel
®
5100 MCH Chipset
1.4 Thermal Simulation
Intel provides thermal simulation models of the Intel
®
5100 MCH Chipset and
associated user’s guides to aid system designers in simulating, analyzing, and
optimizing their thermal solutions in an integrated, system-level environment. The
models are for use with the commercially available Computational Fluid Dynamics
(CFD)-based thermal analysis tools Flomerics* FLOTHERM* (version 5.1 or higher) and
Fluent* Icepak* (version 4.3.10 or higher). Contact your Intel field sales representative
to order the thermal models and user’s guides.
2.0 Packaging Technology
Intel
®
5100 MCH Chipset-based platforms consist of two individual components: the
Intel
®
5100 MCH Chipset and the ICH9R. The Intel
®
5100 MCH Chipset uses a 42.5
mm, 10-layer flip chip ball grid array (FC-BGA) package (see Figure 2, Figure 3, and
Figure 4). For information on the ICH9R package, refer to the Intel
®
I/O Controller Hub
9 (ICH9) Family Thermal and Mechanical Design Guidelines.
Intel
®
I/O Controller Hub 9 (ICH9) Family Thermal and
Mechanical Design Guidelines
http://www.intel.com/ (316974)
Quad-Core and Dual-Core Intel
®
Xeon
®
Processor 5000
Sequence with Intel
®
5100 Memory Controller Hub Chipset for
Communications, Embedded, and Storage Applications –
Platform Design Guide
Note 1
Quad-Core Intel
®
Xeon
®
Processor 5300 Series Datasheet http://www.intel.com/ (315569)
Quad-Core Intel
®
Xeon
®
Processor 5300 Series Specification
Update
http://www.intel.com/ (315338)
Quad-Core Intel
®
Xeon
®
Processor 5300 Series Thermal/
Mechanical Design Guidelines
http://www.intel.com/ (315794)
Quad-Core Intel
®
Xeon
®
Processor 5400 Series Datasheet http://www.intel.com/ (318589)
Quad-Core Intel
®
Xeon
®
Processor 5400 Series Specification
Update
http://www.intel.com/ (318585)
Quad-Core Intel
®
Xeon
®
Processor 5400 Series Thermal/
Mechanical Design Guidelines
http://www.intel.com/ (318611)
Quad-Core Intel
®
Xeon
®
Processor L5318 in Embedded
Applications Thermal and Mechanical Design Guidelines
http://www.intel.com/ (318474)
Various system thermal design suggestions http://www.formfactors.org
Table 2. Related Documents (Sheet 2 of 2)
Document Document Number/URL
Notes:
1. Contact your Intel sales representative. Some documents may not be available at this time.