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Intel
®
5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
July 2008 TDG
Order Number: 318676-003US 25
Intel
®
5100 MCH Chipset
The Intel
®
5100 MCH Chipset has a lower TDP than the Intel
®
5000 Series Chipset and
a similar package size. Due to this, any thermal solutions for the Intel
®
5000 Series
Chipset should be reusable for the Intel
®
5100 MCH Chipset including the Intel
reference solutions. The system designer still needs to verify that the entire thermal
solution will meet the component temperature specifications and TDP in the intended
system.
6.1 AdvancedTCA* Reference Heatsink
6.1.1 Thermal Performance
The AdvancedTCA* reference heatsink should be made from aluminum to achieve the
necessary thermal performance. Depending on the boundary conditions, the reference
heatsink can meet the thermal performance needed to cool the Intel
®
5100 MCH
Chipset in the AdvancedTCA* form factor. The heatsink performance versus airflow
velocity is shown in Figure 18. The heatsink may be used in other form factors that can
provide the required amount of airflow to meet the components thermal specifications.
6.1.2 Mechanical Design Envelope
While each design may have unique mechanical volume and height restrictions or
implementation requirements, the height, width, and depth constraints typically placed
on the Intel
®
5100 MCH Chipset thermal solution are shown in Figure 19.
Figure 18. Torsional Clip Heatsink Measured Thermal Performance versus Approach
Velocity
0.000
0.500
1.000
1.500
2.000
2.500
3.000
3.500
4.000
4.500
0 100 200 300 400 500 600 700 800 900 1000 1100 1200 1300
Airflow Approach Velocity (LFM)
Case-to-Ambient Thermal Characterization Parameter,
Ψ
CA
(°C/W)
ATCA Heatsink
AdvancedTCA* Heatsink