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Intel
®
5100 Memory Controller Hub Chipset for Communications, Embedded, and Storage Applications
July 2008 TDG
Order Number: 318676-003US 27
Intel
®
5100 MCH Chipset
Full mechanical drawings of the thermal solution assembly and the heatsink clip are
provided in Appendix A. Appendix B contains vendor information for each thermal
solution component.
6.1.5 Heatsink Orientation
Because this solution is based on a unidirectional heatsink, the mean airflow direction
must be aligned with the direction of the heatsink fins.
6.1.6 Extruded Heatsink Profiles
The reference thermal solution uses an extruded heatsink for cooling the MCH.
Appendix B lists a supplier for this extruded heatsink. Other heatsinks with similar
dimensions and increased thermal performance may be available. A full mechanical
drawing of this heatsink is provided in Appendix A.
6.1.7 Mechanical Interface Material
There is no mechanical interface material associated with this reference solution.
6.1.8 Thermal Interface Material
A thermal interface material (TIM) provides improved conductivity between the IHS
and heatsink. The reference thermal solution uses Honeywell* PCM45F, 0.25 mm
(0.010") thick, 25 mm x 25 mm (0.984" x 0.984") squared.
Note: Unflowed or “dry” Honeywell* PCM45F has a material thickness of 0.010". The flowed
or “wet” Honeywell* PCM45F has a material thickness of ~0.003" after it reaches its
phase change temperature.
Figure 20. Torsional Clip Heatsink Assembly