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33 PRELIMINARY
8XC251SA/SB/SP/SQ HIGH-PERFORMANCE CHMOS MICROCONTROLLER
6.0 THERMAL CHARACTERISTICS
All thermal impedance data is approximate for static
air conditions at 1 watt of power dissipation. Values
change depending on operating conditions and
application requirements. The Intel
Packaging
Handbook
(order number 240800) describes Intel’s
thermal impedance test methodology.
Table 16. Thermal Characteristics
Package Type θ
JA
θ
JC
44-pin PLCC 46°C/W 16°C/W
40-pin PDIP 45°C/W 16°C/W
40-pin Ceramic DIP 30.5°C/W 10°C/W
7.0 NONVOLATILE MEMORY PROGRAMMING AND VERIFICATION
CHARACTERISTICS
7.1 Definition of Nonvolatile Memory Symbols
Table 17. Nonvolatile Memory Timing Symbol Definitions
Signals Conditions
A Address H High
D Data In L Low
Q Data Out V Valid
S Supply X No Longer Valid
G PROG# Z Floating
E Enable