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4 PRELIMINARY
8XC251SA/SB/SP/SQ HIGH-PERFORMANCE CHMOS MICROCONTROLLER
1.0 NOMENCLATURE
Figure 2. The 8XC251SA/SB/SP/SQ Family Nomenclature
Table 1. Description of Product Nomenclature
Parameter Options Description
Temperature and Burn-in
Options
no mark Commercial operating temperature range (0°C to 70°C) with
Intel standard burn-in.
T Express operating temperature range (-40°C to 85°C) with
Intel standard burn-in.
Packaging Options N 44-pin Plastic Leaded Chip Carrier (PLCC)
P 40-pin Plastic Dual In-line Package (PDIP)
C 40-pin Ceramic Dual In-line Package (Ceramic DIP)
Program Memory Options 0 Without ROM/OTPROM/EPROM
3ROM
7 User programmable OTPROM/EPROM
Process Information C CHMOS
Product Family 251 8-bit control architecture
Device Memory Options SA 1-Kbyte RAM/8-Kbyte ROM/OTPROM/EPROM
SB 1-Kbyte RAM/16-Kbyte ROM/OTPROM/EPROM or without
ROM/OTPROM/EPROM
SP 512-byte RAM/8-Kbyte ROM/OTPROM/EPROM
SQ 512-byte RAM/16-Kbyte ROM/OTPROM/EPROM or without
ROM/OTPROM/EPROM
Device Speed 16 External clock frequency
Program-memory Options
XXXXX XXXX8XXX
Packaging Options
Temperature and Burn-in Options
A2815-01
Process Information
Product Family
Device Speed