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Installation Requirements
3-18 C156-E205-01EN
3.6 Notes on Drive Handling
(1) General notes
Note the following points to maintain drive performance and reliability:
Device damage:
1) Shock or vibration applied to the drive that exceeds the values
defined in the standard damage the drive. Use care when
unpacking.
2) Do not leave the drive in dirty or contaminated environments.
3) Since static discharge may destroy the CMOS devices in the
drive, pay attention to the following points after unpacking:
• Use an antistatic mat and wrist strap when handling the
drive.
• Hold the mounting frame when handling the drive. Do
not touch the Printed circuit board except when setting the
switches.
4) When handling the drive, hold both sides of the mounting
frame. When touching other than both sides of the mounting
frame, avoid putting force.
5) Do not forcibly push up the end of the header pin of the printed
circuit board unit when handling or setting the drive.
(2) Unpacking
a) Make sure that the UP label on the package is pointing upward and start
unpacking on a level surface. Handle the drive on a soft surface such as a
rubber mat, not on a hard surface such as a desk.
b) Use care to avoid exerting excessive pressure on the unit when removing the
cushions.
c) Use care to avoid exerting excessive pressure on the printed circuit board
surface and interface connectors when removing the drive from the antistatic
bag.
d) If the temperature difference between installation locations is 10 degrees or
more, leave the drive in the new location for at least two hours before
unpackaging it.