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10 Intel® Xeon® Processor E5-1600/ E5-2600/E5-4600 Product Families
Datasheet Volume One
7-8 Fault Resilient Booting (Output Tri-State) Signals.................................................163
7-9 Processor Absolute Minimum and Maximum Ratings .............................................164
7-10 Storage Condition Ratings.................................................................................165
7-11 Voltage Specification........................................................................................167
7-12 Processor Current Specifications ........................................................................168
7-13 8/6 Core: Processor VCC Static and Transient Tolerance .......................................169
7-14 4/2-Core: Processor VCC Static and Transient Tolerance .......................................170
7-15 VCC Overshoot Specifications ............................................................................173
7-16 DDR3 and DDR3L Signal DC Specifications ..........................................................174
7-17 PECI DC Specifications .....................................................................................176
7-18 System Reference Clock (BCLK{0/1}) DC Specifications........................................176
7-19 SMBus DC Specifications...................................................................................176
7-20 JTAG and TAP Signals DC Specifications..............................................................177
7-21 Serial VID Interface (SVID) DC Specifications ......................................................177
7-22 Processor Asynchronous Sideband DC Specifications.............................................178
7-23 Miscellaneous Signals DC Specifications ..............................................................179
7-24 Processor I/O Overshoot/Undershoot Specifications..............................................182
7-25 Processor Sideband Signal Group Overshoot/Undershoot Tolerance ........................184
8-1 Land Name .....................................................................................................187
8-2 Land Number ..................................................................................................212
9-1 Processor Loading Specifications........................................................................241
9-2 Package Handling Guidelines .............................................................................241
9-3 Processor Materials ..........................................................................................242
10-1 PWM Fan Frequency Specifications For 4-Pin Active Thermal Solution......................254
10-2 8 Core / 6 Core Server Thermal Solution Boundary Conditions ...............................256
10-3 4 Core Server Thermal Solution Boundary Conditions ...........................................256