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Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families 123
Datasheet Volume One
Thermal Management Specifications
5.1.3.9 4-Core 130W Thermal Specifications
Notes:
1. These values are specified at V
CC_MAX
for all processor frequencies. Systems must be designed to ensure
the processor is not to be subjected to any static V
CC
and I
CC
combination wherein V
CC
exceeds V
CC_MAX
at
specified ICC. Please refer to the electrical loadline specifications in Section 7.8.1.
2. Thermal Design Power (TDP) should be used for processor thermal solution design targets. TDP is not the
maximum power that the processor can dissipate. TDP is measured at maximum T
CASE
.
3. These specifications are based on final silicon characterization.
4. Power specifications are defined at all VIDs found in Table 7-3. The processor may be delivered under
multiple VIDs for each frequency.
5. FMB, or Flexible Motherboard, guidelines provide a design target for meeting all planned processor
frequency requirements.
Notes:
1. This Thermal Profile is representative of a volumetrically unconstrained platform. Please refer to Table 5-19
for discrete points that constitute the thermal profile.
2. Implementation of this Thermal Profile should result in virtually no TCC activation. Refer to the
Intel®
Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families Thermal/Mechanical Design Guide
for
system and environmental implementation details.
Table 5-18. Tcase: 4-Core 130W Thermal Specifications 2U
Core
Frequency
Thermal Design
Power (W)
Minimum
T
CASE
(°C)
Maximum
T
CASE
(°C)
Notes
Launch to FMB 130 5 See Figure 5-19 and Table 5-19 1, 2, 3, 4, 5
Figure 5-19. Tcase: 4-Core 130W Thermal Profile 2U