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Overview
20 Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
Datasheet Volume One
• Memory thermal monitoring via MEM_HOT_C01_N and MEM_HOT_C23_N Signals
1.3.4 PCI Express
• L0s is not supported
• L1 ASPM power management capability
1.3.5 Intel QuickPath Interconnect
• L0s is not supported
• L0p and L1 power management capabilities
1.4 Thermal Management Support
• Digital Thermal Sensor with multiple on-die temperature zones
• Adaptive Thermal Monitor
• THERMTRIP_N and PROCHOT_N signal support
• On-Demand mode clock modulation
• Open and Closed Loop Thermal Throttling (OLTT/CLTT) support for system memory
in addition to Hybrid OLTT/CLTT mode
• Fan speed control with DTS
• Two integrated SMBus masters for accessing thermal data from DIMMs
• New Memory Thermal Throttling features via MEM_HOT_C{01/23}_N signals
• Running Average Power Limit (RAPL), Processor and DRAM Thermal and Power
Optimization Capabilities
1.5 Package Summary
The processor socket is a 52.5 x 45 mm FCLGA package (LGA2011-0 land FCLGA10).
1.6 Terminology
Term Description
ASPM Active State Power Management
BMC Baseboard Management Controllers
Cbo Cache and Core Box. It is a term used for internal logic providing ring interface to
LLC and Core.
DDR3 Third generation Double Data Rate SDRAM memory technology that is the
successor to DDR2 SDRAM
DMA Direct Memory Access
DMI Direct Media Interface
DMI2 Direct Media Interface Gen 2
DTS Digital Thermal Sensor
ECC Error Correction Code