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Boxed Processor Specifications
246 Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
Datasheet Volume One
Figure 10-4. Boxed Processor Motherboard Keepout Zones (1 of 4)
13
4
5678
B
C
D
A
123
4
5678
B
C
D
A
2X 46.0
SOCKET ILM
HOLE PATTERN
2X 69.2
SOCKET ILM
HOLE PATTERN
2200 MISSION COLLEGE BLVD.
R
P.O. BOX 58119
SANTA CLARA, CA 95052-8119
4X
SOCKET ILM
MOUNTING HOLES
3.8
93.0
MAX THERMAL
SOLUTION ENVELOPE
AND MECHANICAL PART CLEARANCE
(FINGER ACCESS NOT INCLUDED)
93.0
MAX THERMAL
SOLUTION ENVELOPE AND
MECHANICAL PART CLEARANCE
(51.0 )
SOCKET BODY OUTLINE
(FOR REFERENCE ONLY)
(58.5 )
SOCKET BODY OUTLINE
(FOR REFERENCE ONLY)
G11950 1 B
DWG. NO SHT. REV
SHEET 1 OF 4
DO NOT SCALE DRAWING
SCALE: 1
BG11950D
REV
DRAWING NUMBER
SIZE
LGA 2011 ENABLING KEEPOUT ZONES
TITLE
PTMI
DEPARTMENT
N/AN/A
FINISHMATERIAL
DATEAPPROVED BY
07/05/10NEAL ULEN
DATECHECKED BY
06/30/10D. LLAPITAN
DATEDRAWN BY
06/30/10D. LLAPITAN
DATEDESIGNED BY
UNLESS OTHERWISE SPECIFIED
INTERPRET DIMENSIONS AND TOLERANCES
IN ACCORDANCE WITH ASME Y14.5M-1994
DIMENSIONS ARE IN MM
TOLERANCES:
.X ± 0.0 Angles ± 0.0 °
.XX ± 0.00
.XXX ± 0.000
THIRD ANGLE PROJECTION
REVISION HISTORY
ZONE REV DESCRIPTION DATE APPR
-A
INITIAL RELEASE FOR FUTURE BOARD BUILDS DEVIATING FROM E59036.
CHANGED ZONE 4, UPDATED NOTES FOR CLARIFICATION.
ADDED A NEW ZONE 7 ON PRIMARY SIDE.
CHANGED ZONE 8 FOR UPDATED BACKPLATE.
REMOVED HEATSINK HOLE MOUNTING LOCATIONS
REMOVED LEVER FINGER ACCESS TABS OUTSIDE 93.5x93.5 SQUARE.
REDUCED MAX THERMAL RETENTION OUTLINE TO 93X93MM.
06/30/10
-
B
ADDED NOTE 8 FOR FURTHER CLARIFICATION
08/26/10
DL
THIS DRAWING CONTAINS INTEL CORPORATION CONFIDENTIAL INFORMATION. IT IS DISCLOSED IN CONFIDENCE AND ITS CONTENTS
MAY NOT BE DISCLOSED, REPRODUCED, DISPLAYED OR MODIFIED, WITHOUT THE PRIOR WRITTEN CONSENT OF INTEL CORPORATION.
NOTES:
1. THIS DRAWING TO BE USED IN CORELATION WITH SUPPLIED 3D DATA BASE FILE. ALL DIMENSIONS AND
TOLERANCES ON THIS DRAWING TAKE PRECEDENCE OVER SUPPLIED FILE.
2. DIMENSIONS STATED IN MILLIMETERS AND DEFINE ZONES, THEY HAVE NO TOLERANCES ASSOCIATED
WITH THEM.
3. SOCKET KEEP OUT DIMENSIONS SHOWN FOR REFERNCE ONLY.
4. MAXIMUM OUTLINE OF SOCKET MUST BE PLACED SYMMETRIC TO THE ILM HOLE PATTERN FOR PROPER
ILM AND SOCKET FUNCTION.
5 A HEIGHT RESTRICTION ZONE IS DEFINED AS ONE WHERE ALL COMPONENTS PLACED ON THE
SURFACE OF THE MOTHERBOARD MUST HAVE A MAXIMUM HEIGHT NO GREATER THAN THE HEIGHT
DEFINED BY THAT ZONE.
ALL ZONES DEFINED WITHIN THE 93.5 X 93.5 MM OUTLINE REPRESENT SPACE THAT RESIDES BENEATH
THE HEATSINK FOOTPRINT.
UNLESS OTHERWISE NOTED ALL VIEW DIMENSION ARE NOMINAL. ALL HEIGHT RESTRICTIONS ARE
MAXIMUMS. NEITHER ARE DRIVEN BY IMPLIED TOLERANCES.
A HEIGHT RESTRICTION OF 0.0 MM REPRESENTS THE TOP (OR BOTTOM) SURFACE OF THE MOTHERBOARD
AS THE MAXIMUM HEIGHT. THIS IS A NO COMPONENT PLACEMENT ZONE INCLUDING SOLDER BUMPS.
SEE NOTE 6 FOR ADDITIONAL DETAILS.
6 ASSUMING A GENERIC A MAXIMUM COMPONENT HEIGHT ZONE.
CHOICE OF AND COMPONENT PLACEMENT IN THIS ZONE MUST INCLUDE:
- COMPONENT NOMINAL HEIGHT
- COMPONENT TOLERANCES
- COMPONENT PLACEMENT TILT
- SOLDER REFLOW THICKNESS
DO NOT PLACE COMPONENTS IN THIS ZONE THAT WILL EXCEED THIS MAXIMUM COMPONENT HEIGHT.
7
ASSUMES PLACEMENT OF A 0805 CAPACITOR WITH DIMENSIONS:
- CAP NOMINAL HEIGHT = 1.25MM (0.049")
- COMPONENT MAX MATERIAL CONDITION HEIGHT NOT TO EXCEED 1.50MM.
8 SIZE & HEIGHT OF FINGER ACCESS TO BE DETERMINED BY SYSTEM/BOARD ARCHITECT. THIS IS ILM
MECHANICAL CLEARANCE ONLY AND FINGER AND/OR TOOL ACCESS SHOULD DETERMINED SEPERATELY.
BALL 1 CORNER
POSITIONAL MARKING
(FOR REFERENCE ONLY)
2X FINGER
ACCESS 8
LEGEND, SHEETS 1 & 2 ONLY
ZONE 1:
0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT,
SOCKET, ILM, AND FINGER ACCESS KEEPIN ZONE
ZONE 2:
7.2 MM MAX COMPONENT HEIGHT. 6
ZONE 3:
0.0 MM MAX COMPONENT HEIGHT, NO COMPONENT PLACEMENT,
NO ROUTE ZONE
ZONE 4:
1.67 MM MAX COMPONENT HEIGHT AFTER REFLOW 5 6
1.50 MM MAX (MMC) COMPONENT HEIGHT BEFORE REFLOW 5 7
ZONE 5:
1.6 MM MAX COMPONENT HEIGHT. 6
ZONE 6:
1.5 MM MAX COMPONENT HEIGHT. 6
ZONE 7:
1.9 MM MAX COMPONENT HEGHT. 6
The drawing contains intel corporation information. Its contents may not be reproduced,
displayed, or modified without the prior written consent of Intel Corporation.