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Intel® Xeon® Processor E5-1600/ E5-2600/E5-4600 Product Families 5
Datasheet Volume One
7 Electrical Specifications......................................................................................... 151
7.1 Processor Signaling ......................................................................................... 151
7.1.1 System Memory Interface Signal Groups ................................................. 151
7.1.2 PCI Express* Signals ............................................................................ 151
7.1.3 DMI2/PCI Express* Signals.................................................................... 151
7.1.4 Intel QuickPath Interconnect (Intel QPI) .................................................. 151
7.1.5 Platform Environmental Control Interface (PECI) ...................................... 152
7.1.6 System Reference Clocks (BCLK{0/1}_DP, BCLK{0/1}_DN)....................... 152
7.1.7 JTAG and Test Access Port (TAP) Signals ................................................. 153
7.1.8 Processor Sideband Signals ................................................................... 153
7.1.9 Power, Ground and Sense Signals........................................................... 153
7.1.10 Reserved or Unused Signals................................................................... 158
7.2 Signal Group Summary .................................................................................... 158
7.3 Power-On Configuration (POC) Options............................................................... 162
7.4 Fault Resilient Booting (FRB)............................................................................. 163
7.5 Mixing Processors............................................................................................ 163
7.6 Flexible Motherboard Guidelines (FMB)............................................................... 164
7.7 Absolute Maximum and Minimum Ratings ........................................................... 164
7.7.1 Storage Conditions Specifications ........................................................... 165
7.8 DC Specifications ............................................................................................ 166
7.8.1 Voltage and Current Specifications.......................................................... 167
7.8.2 Die Voltage Validation........................................................................... 173
7.8.3 Signal DC Specifications........................................................................ 174
7.9 Waveforms..................................................................................................... 180
7.10 Signal Quality ................................................................................................. 181
7.10.1 DDR3 Signal Quality Specifications ......................................................... 182
7.10.2 I/O Signal Quality Specifications............................................................. 182
7.10.3 Intel QuickPath Interconnect Signal Quality Specifications.......................... 182
7.10.4 Input Reference Clock Signal Quality Specifications................................... 182
7.10.5 Overshoot/Undershoot Tolerance............................................................ 182
8 Processor Land Listing........................................................................................... 187
8.1 Listing by Land Name ...................................................................................... 187
8.2 Listing by Land Number ................................................................................... 212
9 Package Mechanical Specifications ........................................................................ 237
9.1 Package Mechanical Drawing............................................................................. 237
9.2 Processor Component Keep-Out Zones............................................................... 241
9.3 Package Loading Specifications ......................................................................... 241
9.4 Package Handling Guidelines............................................................................. 241
9.5 Package Insertion Specifications........................................................................ 241
9.6 Processor Mass Specification............................................................................. 242
9.7 Processor Materials.......................................................................................... 242
9.8 Processor Markings.......................................................................................... 242
10 Boxed Processor Specifications ............................................................................. 243
10.1 Introduction ................................................................................................... 243
10.1.1 Available Boxed Thermal Solution Configurations...................................... 243
10.1.2 Intel Thermal Solution STS200C
(Passive/Active Combination Heat Sink Solution) ...................................... 243
10.1.3 Intel Thermal Solution STS200P and STS200PNRW
(Boxed 25.5 mm Tall Passive Heat Sink Solutions).................................... 244
10.2 Mechanical Specifications ................................................................................. 245
10.2.1 Boxed Processor Heat Sink Dimensions and Baseboard Keepout Zones ........ 245
10.2.2 Boxed Processor Retention Mechanism and Heat Sink Support (ILM-RS) ...... 254
10.3 Fan Power Supply [STS200C]............................................................................ 254
10.3.1 Boxed Processor Cooling Requirements ................................................... 255
10.4 Boxed Processor Contents ................................................................................ 257