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Boxed Processor Specifications
256 Intel® Xeon® Processor E5-1600/E5-2600/E5-4600 Product Families
Datasheet Volume One
Notes:
1. Local ambient temperature of the air entering the heatsink or fan. System ambient and altitude are assumed 35°C and sea
level.
2. Max target (mean + 3 sigma) for thermal characterization parameter.
3. Airflow through the heatsink fins with zero bypass. Max target for pressure drop (dP) measured in inches H2O.
4. See Table 10-2 and Table 10-3 for detailed dimensions. Dimensions of heatsinks do not include socket or processor.
10.4 Boxed Processor Contents
The Boxed Processor and Boxed Thermal Solution contents are outlined below.
Table 10-2. 8 Core / 6 Core Server Thermal Solution Boundary Conditions
TDP
Thermal
Solution
ΨCA
2
(˚C/W) T
LA
1
(˚C)
Airflow
3
(CFM)
Delta P (inch
of H
2
O)
Heatsink
Volumetric
4
(mm)
150W (WS Only)
8 Core
STS200C (with
fan)
0.180 40.0 Max RPM N/A 91.5x91.5x64
130W (1U) 6 and
8 Core
STS200P 0.242 53.6 16 0.406 91.5x91.5x25.5
130W (1U) 6 and
8 Core
STS200PNRW 0.253 52.2 14 0.347 70x106x25.5
130W (2U) 6 and
8 Core
STS200C
(without fan)
0.180 61.6 26 0.14 91.5x91.5x64
130W (Pedestal)
6 and 8 Core
STS200C (with
fan)
0.180 61.6 Max RPM N/A 91.5x91.5x64
115W (Pedestal)
8 Core
STS200P 0.241 52.2 16 0.406 91.5x91.5x25.5
115W (Pedestal)
8 Core
STS200PNRW 0.252 51.0 14 0.347 70x106x25.5
115W (Pedestal)
8 Core
STS200C (with
fan)
0.179 59.4 Max RPM N/A 91.5x91.5x64
95W (1U) 6 and
8 Core
STS200P 0.243 49.9 16 0.406 91.5x91.5x25.5
95W (1U) 6 and
8 Core
STS200PNRW 0.254 48.9 14 0.347 70x106x25.5
95W (Pedestal) 6
and 8 Core
STS200C (with
fan)
0.181 55.8 Max RPM N/A 91.5x91.5x64
70W(1U) 8 Core STS200P 0.239 47.2 16 0.406 91.5x91.5x25.5
70W(1U) 8 Core STS200PNRW 0.250 46.5 14 0.347 70x106x25.5
70W (Pedestal) 8
Core
STS200C (with
fan)
0.177 51.6 Max RPM N/A 91.5x91.5x64
60W(1U) 8 Core STS200P 0.239 45.7 16 0.406 91.5x91.5x25.5
60W(1U) 8 Core STS200PNRW 0.250 45.0 14 0.347 70x106x25.5
60W(Pedestal) 8
Core
STS200C (with
fan)
0.177 49.4 Max RPM N/A 91.5x91.5x64
Table 10-3. 4 Core Server Thermal Solution Boundary Conditions
TDP
Thermal
Solution
ΨCA
2
(˚C/W) T
LA
1
(˚C)
Airflow
3
(CFM)
(inch of H
2
O)
Delta P
Heatsink
Volumetric
4
(mm)
130W (Pedestal) STS200C (with
fan)
0.199 47.1 Max RPM N/A 91.5x91.5x64
80W- 1U) STS200P 0.261 49.1 16 0.406 91.5x91.5x25.5
80W- 1U) STS200PNRW 0.272 48.2 14 0.347 70x106x25.5