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Si5351A/B/C
Preliminary Rev. 0.95 67
14. Package Outline (24-Pin QSOP)
Table 14. 24-QSOP Package Dimensions
Dimension Min Nom Max
A——1.75
A1 0.10 — 0.25
b 0.19 — 0.30
c 0.15 — 0.25
D 8.558.658.75
E 6.00 BSC
E1 3.81 3.90 3.99
e 0.635 BSC
L 0.40 — 1.27
L2 0.25 BSC
q0—8
aaa 0.10
bbb 0.17
ccc 0.10
Notes:
1.
All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MO-137, Variation C
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020 specification for Small Body
Components.