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Technical Reference Guide www.hp.com 2-3
System Overview
Table 2-1 shows the differences in features between the different PC series based on form factor.
NOTES:
[1] 2nd serial port requires optional cable/bracket assembly.
[2] Low-profile, 25 W maximum.
[3] Low profile, 10-watt maximum
[4] Full-length;
75-watt maximum if PCIe x4 slot is not populated,
35-watt maximum if PCIe x4 slot is populated
[5] 35-watt maximum
[6] Half-height, half-length, 10-watt maximum
[7] 3.5” devices supported with adapters
[8] 2.5” solid state drives supprted with adapter brackets
[9] Slimline bay
Table 2-1
Feature Differences by Form Factor
USDT SFF MT CMT
Thermal Design Power (TPD)
(processor)
65 W 95 W 95 W 95 W
# and type of memory sockets 2 DDR3
SODIMMs
4 DDR3
UDIMMs
4 DDR3
UDIMMs
4 DDR3
UDIMMs
Serial ports 0 1 std.,
1 opt. [1]
1 std.,
1 opt. [1]
1 std.,
1 opt. [1]
Parallel ports 0 optional optional optional
Drive bays:
Externally accessible
Internal
1 [9]
1- 2.50”
1 - 5.25”
1 - 3.50”
1 - 3.50”
2 - 5.25” [7]
1 - 3.50”
2 - 3.50” [8]
3 - 5.25” [7]
3 - 3.50” [8]
# of SATA/eSATA drives
supported:
23/14 5
MXM 3.0 slot? Yes No No No
PCIe slots:
2.0 x16 (graphics)
2.0 x4 (x16 connector)
2.0 x1 connector
1.2 Mini Card 1
(all low profile)
1 [2]
1 [2]
1 [3]
0
(all full height)
1 [4]
1 [5]
1 [6]
0
(all full height)
1 [4]
1 [5]
1 [6]
0
PCI 2.3 32-bit 5-V slot,
25-watt maximum
1 1 full-height 3 full-height
Power Supply Unit:
Module type
Power rating
external
135- or180-watt
internal
240-watt
internal
320-watt
internal
320-watt