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Intel
®
E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 11
Bridge (XMB) Thermal/Mechanical Design Guide
2 Packaging Technology
The E8500/E8501 chipsets consist of four individual components: the NB, the XMB, the
Intel
®
6700PXH 64-bit PCI Hub and the I/O controller hub (ICH5R). The E8500/E8501 chipset
NB component use a 42.5 mm squared, 12-layer flip chip ball grid array (FC-BGA) package (see
Figure 2-1 through Figure 2-3). The E8500/E8501 chipset XMB component uses a 37.5 mm
squared, 10-layer FB-BGA package (see Figure 2-4 through Figure 2-6). For information on the
Intel 6700PXH 64-bit PCI Hub package, refer to the Intel
®
6700PXH 64-bit PCI Hub
Thermal/Mechanical Design Guide. For information on the ICH5 package, refer to the
Intel
®
82801EB I/O Controller Hub 5 (ICH5) and Intel
®
82801ER I/O Controller Hub 5 R
(ICH5R) Thermal Design Guide.
Figure 2-1. NB Package Dimensions (Top View)
Figure 2-2. NB Package Dimensions (Side View)
TNB
IHS
42.5 mm
42.5 mm38.5 mm
38.5 mm
Handling
Exclusion
Area
NB
IHS
0.20 –C–
IHS
Substrate
0.435 ± 0.025 mm
See Note 3
Seating Plane
2.44 ± 0.071 mm
See Note 1
Notes:
1. Primary datum -C- and seating plan are defined by the spherical crowns of the solder balls (shown before motherboard attach)
2. All dimensions and tolerances conform to ANSI Y14.5M-1994
3. BGA has a pre-SMT height of 0.5mm and post-SMT height of 0.41-0.46mm
4. Shown before motherboard attach; FCBGA has a convex (dome shaped) orientation before reflow and is expected to have a slightly concave (bowl shaped)
orientation after reflow
0.20
See Note 4
3.79 ± 0.144 mm
4.23 ± 0.146 mm