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14 Intel
®
E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
2.1 Package Mechanical Requirements
The E8500/E8501c chipset NB package has an IHS and the XMB package has an exposed bare die
which is capable of sustaining a maximum static normal load of 15-lbf. The package is NOT
capable of sustaining a dynamic or static compressive load applied to any edge of the bare die.
These mechanical load limits must not be exceeded during heatsink installation, mechanical stress
testing, standard shipping conditions and/or any other use condition.
Notes:
1. The heatsink attach solutions must not include continuous stress onto the chipset package with
the exception of a uniform load to maintain the heatsink-to-package thermal interface.
2. These specifications apply to uniform compressive loading in a direction perpendicular to the
bare die/IHS top surface.
3. These specifications are based on limited testing for design characterization. Loading limits
are for the package only
§
Figure 2-6. XMB Package Dimensions (Bottom View)
42.5 + 0.0
5
11 252321191715139753127293733 3531
2822 26242018161412108642 36343230 38
A
AJ
AE
A
C
AA
U
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N
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A
N
A
R
A
U
A
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B
42.5 + 0.05
C
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0.2
37X 1.092
20.202
20.202
37X 1.092