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12 Intel
®
E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
NOTES:
1. All dimensions are in millimeters.
2. All dimensions and tolerances conform to ANSI Y14.5M-1994.
Figure 2-3. NB Package Dimensions (Bottom View)
42.5 + 0.05
11 252321191715139753127293733 3531
2822 26242018161412108642 36343230 38
A
AJ
AE
A
C
AA
U
R
N
L
J
G
E
C
W
AG
AL
A
N
A
R
A
U
A
H
AF
A
D
AB
Y
V
T
P
M
K
H
F
D
AK
AM
AP
AT
AV
B
A
B
42.5 + 0.05
C
A
0.2
37X 1.092
20.202
20.202
37X 1.092