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NB Reference Thermal Solution #2
34 Intel
®
E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
7.5.1 Heatsink Orientation
Since this solution is based on a unidirectional heatsink, mean airflow direction must be aligned
with the direction of the heatsink fins.
7.5.2 Extruded Heatsink Profiles
Please refer to Section 6.5.2 for detail.
7.5.3 Mechanical Interface Material
There is no mechanical interface material associated with this reference solution.
7.5.4 Thermal Interface Material
Please refer to Section 6.5.4 for detail.
7.5.4.1 Effect of Pressure on TIM Performance
Please refer to Section 6.5.4.1 for detail.
7.5.5 Heatsink Retaining Fastener
The reference solution uses four heatsink retaining Tufloks. The fasteners attached the heatsink to
the motherboard by expanding its Tuflok prong to snap into each of the four heatsink mounting
holes. These fasteners are intended to be used on 0.085” to 0.093” thickness motherboard with
either of the two NB reference thermal solutions. See Appendix B for a mechanical drawing of the
fastener.
Figure 7-3. Second NB Heatsink Assembly