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NB Reference Thermal Solution #2
32 Intel
®
E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
7.3 Mechanical Design Envelope
While each design may have unique mechanical volume and height restrictions or implementation
requirements, the height, width, and depth constraints typically placed on the E8500/E8501 chipset
NB thermal solution are shown in Figure 7-2.
When using heatsinks that extend beyond the NB reference heatsink envelope shown in Figure 7-2,
any motherboard components placed between the heatsink and motherboard cannot exceed
4.14 mm (0.16 in.) in height.
Figure 7-1. Second NB Reference Heatsink Measured Thermal Performance vs.
Approach Velocity
0.5
0.8
1.1
1.4
1.7
2
2.3
0 100 200 300 400 500 600
Flow Rate (LFM)
Ȍca (°C/W)