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Thermal Specifications
16 Intel
®
E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
NOTE:
1. These specifications are based on silicon characterization, however, they may be updated as further data
becomes available.
§
Table 3-2. Intel
®
E8501 Chipset NB Thermal Specifications
Parameter Value Notes
T
case_max
104°C
T
case_min
5°C
TDP
with 1 XMB attached
26.0 W
TDP
with 2 XMBs attached
28.2 W
TDP
with 3 XMBs attached
30.4 W
TDP
with 4 XMBs attached
32.6 W
Table 3-3. Intel
®
E8500 Chipset XMB Thermal Specifications
Parameter Value Notes
T
case_max
105°C
T
case_min
5°C
TDP
dual channel
11.1 W DDR2-400
Table 3-4. Intel
®
E8501 Chipset XMB Thermal Specifications
Parameter Value Notes
T
case_max
105°C
T
case_min
5°C
TDP
dual channel
12.1W DDR2-400