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Intel
®
E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 21
Bridge (XMB) Thermal/Mechanical Design Guide
Thermal Metrology
5.2 Power Simulation Software
The power simulation software is a utility designed to dissipate the thermal design power on an
E8500/E8501 chipset NB component or XMB component when used in conjunction with the
64-bit Intel
®
Xeon
®
processor MP or Dual-Core Intel
®
Xeon
®
processor 7000 sequence. The
combination of the above mentioned processor and the higher bandwidth capability of the
E8500/E8501 chipsets enable higher levels of system performance. To assess the thermal
performance of the chipset thermal solution under “worst-case realistic application” conditions,
Intel is developing a software utility that operates the chipset at near worst-case thermal power
dissipation.
The power simulation software being developed should only be used to test thermal solutions at or
near the thermal design power. Figure 5-1 shows a decision flowchart for determining thermal
solution needs. Real world applications may exceed the thermal design power limit for transient
time periods. For power supply current requirements under these transient conditions, please refer
to each component's datasheet for the ICC (Max Power Supply Current) specification. Contact
your Intel field sales representative to order the power utility software and user's guide.
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