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Thermal Metrology
20 Intel
®
E8500/E8501 Chipset North Bridge (NB) and eXternal Memory
Bridge (XMB) Thermal/Mechanical Design Guide
001240
NOTE: Not to scale.
001321
NOTE: Not to scale.
Figure 5-1. Thermal Solution Decision Flowchart
Figure 5-2. Zero Degree Angle Attach Heatsink Modifications
Figure 5-3. Zero Degree Angle Attach Methodology (Top View)
Cement +
Thermocouple Bead
Die
Thermocouple
Wire
Substrate