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Intel
®
E8500/E8501 Chipset North Bridge (NB) and eXternal Memory 5
Bridge (XMB) Thermal/Mechanical Design Guide
Tables
3-1 Intel
®
E8500 Chipset NB Thermal Specifications ..............................................................15
3-2 Intel
®
E8501 Chipset NB Thermal Specifications ..............................................................16
3-3 Intel
®
E8500 Chipset XMB Thermal Specifications ...........................................................16
3-4 Intel
®
E8501 Chipset XMB Thermal Specifications ...........................................................16
6-1 Chomerics THERMFLOW* T710 TIM Performance as a Function of Attach Pressure .....28
6-2 Reliability Guidelines..........................................................................................................29
A-1 NB Heatsink Thermal Solution #1......................................................................................43
A-2 NB Heatsink Thermal Solution #2......................................................................................44
A-3 XMB Heatsink Thermal Solution........................................................................................45
B-1 Mechanical Drawing List ....................................................................................................47